Copper chloride without H2O2-adding?
I think i will see some PCB-Etchin in the future... So i will need an etchant. Aequous copper chloride was the choice i made since it is a regenerative etchant according to several sources.
Now if i understood the chemistry right (Sorry... electrotechnician here), the reaction in theory only needs the oxygen from the peroxide (H2O2) and the hydrogen isnt used at all?
Since i only have relatively weak peroxide, i plan on using a bubbler to introduce the oxygen to the copper-HCI-mix. This because i dont want to dilute the acid too much...
Will that work?
I know that if i use normal air (which has only around 20% oxygen in it) it will take some time... But would it work in the first place?
I read somewhere that copper and muriatic acid dont really react in the first place...
So if i also understood that right, it needs the oxygen present in the beginning to START reacting... So i think i may go with a contraption like:
- Plastic container with a bubbler installed (Pumps normal air)
- Add Muriatic acid to the container
- Add copper to the acid
- let it bubble till the copper is disolved
Now i have a copper chloride-solution which i can regenerate by adding oxygen (By bubbler or H2O2)?