Step 3Solder to SOICs
Insert the edge of a small square of heavy duty aluminum foil underneath the pin you are going to solder and over the pins on either side (pic4). This will prevent the solder from flowing on to the adjacent pins. It will also act as a heat sink. Clamp the IC onto a sheet of FR-4 fiberglass or perfboard. Put a piece of the Loctite mounting putty over one end of the foil to hold it in place. The magnet wire can then be held in place with the putty and in contact with the IC pin.
Strip and tin enough magnet wire to go to all the pins. You can then clamp one wire to the board holding the IC and aluminum foil shield and use the thin solder to solder the end of the wire to the IC pin. Move the foil and repeat the process for the rest of the pins. When you're done, you should have something which looks about like pic5.
Make a Breakout Board
Solder some .1" header pins to the perfboard that has the traces drilled out where the IC goes. Glue the IC to the perfboard. When the glue is dry, bend and solder the pre tinned wires to the header pins. Try to avoid getting the wires to close to each other as that can cause crosstalk or stray capacitance in some circuits.
You could of course forget the magnet wire and simply use shorter pieces of #30 uninsulated tinned wire. The advantage of leaving the magnet wire long and insulated is that it allows you to solder to the header pins without reheating the solder joints on the IC pins. This reduces the chance of damaging the joint or the IC. After you have tested the circuit, it is probably a good idea to coat the wires with epoxy or liquid tape to increase their insulation value, reduce the chance of crosstalk, and protect them from accidental damage from handling.
Pic5b shows a Picaxe 20x-2 SOIC breakout board module. It gives you the best of both worlds--a powerful microcontroller in a small package and an easy to use plug in module.
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