Step 6: Wiring the Bread Board
The picture below shows how to layout the microprocessor bread board. The red traces are the runs made on the copper side of the board. A fourteen pin dip IC socket is represented as a black rectangle with the IC pins displayed in small blue squares. The socket is placed on the non-copper side of the board, and the numbering reflects this perspective.
All components are placed on the non-copper side of the bread board.
The two yellow traces shown in the picture are jumpers that are placed on the non-copper side of the bread board. The black circles represent connection points.
The second photo shows the schematic.
All components are placed on the non-copper side of the bread board.
The two yellow traces shown in the picture are jumpers that are placed on the non-copper side of the bread board. The black circles represent connection points.
The second photo shows the schematic.
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When soldering the non-insulated wire, I solder at the corners of a straight run and where component leads or jumpers touch the run. It helps to use a pair of pliers or a soldering heat sink clip between a previous soldered joint and the one I'm working to prevent the first solder joint from coming undone.
On this particular project, I was experimenting with copper foil glazing tape that is used by stained glass hobbyists. You can get a lifetime supply for about $6 at hobby shops. I cut the tape I had lengthwise in half to make the runs. I use this tape for various odd connections in some of my projects. It can come in handy.
The tape worked and I think it looked neater. I have now moved on to making my own PC boards using the toner transfer method.
thanks!
I searched back through my project photos and found a picture of a partially completed bread board. I added it to the secondary images on step 6. It should give you a general idea of how I did it.
I hope it helps.