This instructable is about two things: How to build and use a Hot Plate Soldering System, and general guidance on how to design circuit boards using surface mount parts. All the information you need for successful surface mount design and construction. Throughout this Instructable, many sources will be cited: like Newton, I truly stand on the shoulders of giants! (That's another way of saying others have already worked most of this out.) What I'll do is explain the methods I've used successfully to build tiny surface mount circuits. The focus is on specifics, not generalities. I believe the method and tools I'll describe are the most economical available which will yield satisfactory results.
So let's get started. Successful design and construction with those Extremely Tiny devices you've been dying to use is just an Instructable away!
UPDATE February 2010: Closed Loop Control has been added! Have a look at this Instructable.
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Precautions:
- Make sure the traces can carry the current.
- Make sure the traces follow the spacing rules for the AC voltage you use.
Note that the wire and insulation used on the perf board version takes care of these problems.
Probably an even better solution is to simply buy a solid state rely off Ebay. Suitable units are available for less than $10.
BTW, the easiest way to convert from F to C or C to F is to add 40, multiply by 9/5 (C to F) or 5/9 (F to C), then subtract 40.
Whatever works for you.
A better answer is: See the Follow-Up to this Instructable that uses the IR sensor for feedback and a PC to enter and track the temperature.
http://www.instructables.com/id/Closing-the-Loop-on-Surface-Mount-Soldering/
Basically, it uses Arduino for the microcontroller portion.
I use lead solder due to the tin whisker problem. I will switch to lead-free once that is really solved, otherwise anything I build without lead-based solder that needs long-term reliability will require inspection on a regular basis, especially if the board is under thermal or mechanical stress. References:
http://en.wikipedia.org/wiki/Tin_whiskers
http://www.jedec.org/news/pressreleases/jedec-and-ipc-release-tin-whisker-acceptance-testing-standard-and-mitigation-prac
http://nepp.nasa.gov/WHISKER/ (This one has some great pictures of whiskers!)
http://www.usatoday.com/tech/news/2007-10-05-tin-whiskers_N.htm
I think metallurgists will eventually solve the problem, but for now I am sticking with lead-based solders and non-ROHS components unless I have to use lead-free for other reasons. And, my volume is very low.
In it, I show how to use an IR sensor from Harbor Freight to build closed loop control for this process.
Someone else has also reverse engineered the Cen-Tech 96451 handheld unit I bought. Here is a link to that discussion too:
www.instructables.com/community/Cen-Tech-Thermometer-to-PC-Hacking
Here is a link to the Cen-Tech thermometer I used:
www.harborfreight.com/non-contact-laser-thermometer-96451.html
The model I used has more range (up to 500C) and the spot size is 8:1 instead of 6:1. But, my model cost 1/3 more at $30 bucks. Sounds like either model will work.
Thanks for all the info,
Jim
Since you your discussion involves SMT stencils, I thought you may want to know that now Applied Electronics provide both Mylar and Kapton SMT stencils. Starting this coming Thursday (June 25th), we will take order for Kapton too. You can choose either Mylar or Kapton of size 8.5x11 inch (actual size for Kapton is 8.5x12) without any restriction on the area or number of components.
Mylar comes in thickness of 3 and 4 mil.
Kapton comes in thickness of 3 mil only.
Visit the following site for detail
http://www.applied-electronics.com
Regards
Applied Electronics
www.ohararp.com/Stencils.html
I no longer recommend Pololu. Not only do they use mylar, their prices have gone sky high!
Trying this procedure on a board without solder mask is more risky, but might work. I can't say it won't; only that the risk goes up with each move away from using a stencil and solder mask. The risk also increases as pad spacing decreases. So the tinier the part, the more important solder mask and stencil become.
Now here's why I'm not keen on this approach.
- Getting solder on all those tiny pads is a lot of work. The whole point of using a stencil and solder paste is to avoid that work.
- Making the solder reasonably level is nearly impossible, so some pads may not start off touching. This may or may not be a problem, but if there's too much solder on a central pad, then the resulting pillow could keep the other pads from ever touching. Paste and the correct footprints avoids this problem.
- It's really easy to lift a pad from the board with a little too much heat when you're tinning them. Tinning the part itself is a better plan, but I still don't like it.
Hope that helps.
The paste, when bought, is shipped sealed but once opened needs to be stored in the fridge (see the product datasheet) - none of the paste I have used is shipped in dry ice!
PCBPolice Electronics Forum
The forum is new but we have a number of actual HW engineers ready to answer you questions - its just a bit slow to take off (its only a few days old).
PCBPolice Electronics Forum - we need some users....please!