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Step 13Component side
You should be pretty aux-fait with the methods now, however with the component side there is an additional layer of complexity, namely the components.
For an SMD board at least, the detail is too fine for manipulation of the entire image to be useful, so you need to do a lot by hand. You are likely to need the actual board to hand, and possibly a magnifying glass and continuity tester.
Open the picture you chose to use for the component side, and save it as a .xcf file with a meaningful name.
Open as a layer, the picture you created of the all the holes.
Ensure the layer with the component side is selected, and use the scale, rotate and perspective tools to adjust it so that the holes you can see line up with the holes you captured from the solder side. Chances are it won't match exactly. My board is slightly bent, so the alignment was a little bit off in the middle.
You need to create a picture of the components, a picture of the tracks, and pictures which identify any "special" holes.
If you wish to isolate the component identifiers marked on the board, do so now. Click the little red square in the corner of the main image window to turn on the quick mask - the picture will fill up with transparent red. Paint white to erase the mask from the writing. Just do it in blocks, don't try to follow the lines of the letters. Toggling the quick mask (click the little square again) will turn the bits you painted into a selection, and copy to a new transparent layer. Use the "levels" technique described for making the tracks stand out, selecting the text and an area of track (assuming the tracks are lighter than the substrate) for the black and white points. Paint in any bits that get pinched off.
For an SMD board at least, the detail is too fine for manipulation of the entire image to be useful, so you need to do a lot by hand. You are likely to need the actual board to hand, and possibly a magnifying glass and continuity tester.
Open the picture you chose to use for the component side, and save it as a .xcf file with a meaningful name.
Open as a layer, the picture you created of the all the holes.
Ensure the layer with the component side is selected, and use the scale, rotate and perspective tools to adjust it so that the holes you can see line up with the holes you captured from the solder side. Chances are it won't match exactly. My board is slightly bent, so the alignment was a little bit off in the middle.
You need to create a picture of the components, a picture of the tracks, and pictures which identify any "special" holes.
If you wish to isolate the component identifiers marked on the board, do so now. Click the little red square in the corner of the main image window to turn on the quick mask - the picture will fill up with transparent red. Paint white to erase the mask from the writing. Just do it in blocks, don't try to follow the lines of the letters. Toggling the quick mask (click the little square again) will turn the bits you painted into a selection, and copy to a new transparent layer. Use the "levels" technique described for making the tracks stand out, selecting the text and an area of track (assuming the tracks are lighter than the substrate) for the black and white points. Paint in any bits that get pinched off.
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