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Step 12Soldering connections
The connections for the components are made on the bottom of the board with wire-wrap wire. A soldered-in-place component on the top of the board leaves a small pyramid of solder on the component leads. When wire-wrap wire is used for making point to point circuit connections, a very small bit of the wire insulation is removed from the ends of the connecting wire. The “pyramid” of solder is melted and the wire wrap wire end is poked into the melted solder.
The USBmicro site had a guideline for driving an LED from the output pin of a U401 or U421. Extending that to use a ULN2803 for this project was easy. One of the app notes at USBmicro also has a ULN2803 driving LEDs and relays. Both schematic fragments are pictured below to serve as a guide.
The USBmicro site had a guideline for driving an LED from the output pin of a U401 or U421. Extending that to use a ULN2803 for this project was easy. One of the app notes at USBmicro also has a ULN2803 driving LEDs and relays. Both schematic fragments are pictured below to serve as a guide.
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