This instructable will describe the proper method for using a StickNPeel Rework Stencil. TheStickNPeel Rework Stencil simplifies the rework process by eliminating the need to tape down or readjust the stencil during the rework process. This allows for solder paste to be distributed more consistently and easily. Its disposable nature also removes the need for cleaning the stencil in between each print.
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- New device to be placed
- Solder paste
- Isopropyl alcohol and lint free wipes for cleaning the stencil
- Miniature squeegee
- StickNPeel(TM) Stencil
- Reflow source
Step 1: Clean the Site
After removing the original part, clean site with isopropyl alcohol and a lint free wipe to get rid of any contaminantst.
Step 2: Place the Stencil
Peel off the stencil from its adhesive backing and align the apertures in the stencil with the pads on the board. Starting at one corner, place the stencil and slowly work towards the opposite corner. Smooth down the stencil afterwards.
Step 3: Apply Solder Paste
After allowing the solder paste to come to room temperature, stir the paste and apply it to the stencil with a miniature squeegee. Hold the squeegee at a forty-five degree angle to the board and apply the paste using enough force to ensure that sufficient solder is compressed into the apertures. The nice thing is that if you need to go back and refill certain apertures you can do that with an adhesive-backed stencil.
Step 4: Remove the Stencil
Slowly peel off the stencil. Use a consistent speed to avoid smearing the solder paste.
Step 5: Inspect the Paste
Inspect the board to ensure that solder is distributed evenly on all of the pads. Make sure that none of the paste has been disturbed in peeling off the stencil.
Step 6: Place the Part
Gently place the part. Make sure to align the part properly and with the correct orientation.
Step 7: Reflow, Clean, and Inspect
Reflow the part. Afterwards, clean it with isopropyl alcohol and a lint free cloth. Inspect the part for any errors.