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Soldering underneath chips

Step 4Finally sandpaper the PCB

Finally sandpaper the PCB
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  • after sandpaper.jpg
  • tin with braid.jpg
Using wet/dry sandpaper under a tap, carefully sandpaper the remaining solder off the PCB underchip heatsink area till it is bare copper and as flat as can be.

Don't be too agressive with coarse sandpaper or else you might (as I did) grind away surrounding trackwork. Again take your time, and finish with 2000 grit paper to get a good finish.

Look at the picture, although blurry you should be able to see bare copper with two copper slugs where the wires are.

Also note a couple of scratches on some connecting tracks....oops.....hopefully the tinning will take care of these little scratches.

After this, use some used solder braid to tin the pin tracks where the chip will connect.....but leave the heatsink area bare copper....you may need to remove excess tinning with clean solder braid. It is important to have everything flat.
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Author:rgbphil
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