Toaster Oven Reflow Soldering (BGA)

Step 5 Align the components on the PCB.

Position the PCB on the tray of the toaster oven, preferably oriented so that you can keep an eye on it through the window of the oven. Precisely position the component on the PCB using the silk screened outline to do the alignment. You don't have to be exactly accurate since the solder reflowing will actually pull the component into alignment, but you should try to get it as close as possible. Worst case scenario would be having the component offset by more than half of the ball spacing pitch which would cause the component to shift over by one set of pads. Not good.

Comments

[lilimike]

What about the solder?
Did you add solder to the pads?
Will any kind of solder do the job?

[Macka]

I believe the balls on the chip are balls of solder that are preplaced, so no further solder is necessary.