Toaster Oven Reflow Soldering (BGA)

Step 6 Start 'em cooking.

Close the toaster oven door, (make sure you don't bump the component out of alignment.) Set the temperature dial for somewhere around 450 and start the timer at around 20 minutes. Later on once you've determined the characteristics of your particular toaster oven then you can start using exact values. But for right now we're going to use our oven thermometer and the external timer to keep track of what's happening.

Comments

[drsoubhi]

Dear Mr. Colin

Hi,

I have an old Minolta Dimage 7 Digital Camera.

I think that the BGA Processor has some cold welding.
Is it possible to use your procedure to reflow the affected AGP pins?

Also you didn't mention the duration needed for that operation.

I'm a dentist, and I prefer to use a ceramic electronic oven which is more accurate and it's available in any good Dental Lab.

You can read my trouble by visiting the following link:

http://forums.steves-digicams.com/forums/view_topic.php?id=587881&forum_id=20&jump_to=866089#p866089

Please help me regarding this issue.

Soubhi Sabbagh
email: lego(at)aloola.sy
GSM [phone]

[M40]

It is preferable to heat rapidly. Laser systems and some of the induction heating units used for solder paste can reflow paste in less than 1 second with no issues. Problems arise when extremely long heating cycles are used (more than 10 minutes). This is because there is only so much activity in flux chemistries. Expend this activity, and you will have issues. This is due to the fact that flux is used to remove oxides from the surfaces to be bonded. The hotter you get a metal, the faster these oxides form. Once you have expended the activity in a given flux, oxides take over, and nothing bonds well... if at all. That said, toasters and hot-plates are fine as long as you can heat the item(s) to be soldered within a few minutes. 10 minutes is the maximum that I would go on this. Preheat the toaster, and this should be feasible.