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Toaster Oven Reflow Soldering (BGA)

Step 9Let it cool, and don't move anything!

Let it cool, and don\
You can speed up the cooling process by opening up the front door of the toaster oven... BUT, make sure you don't jostle the components or move them in any way. The solder is still liquid at this point and if you poke at the component you will shift it around and ruin it. This is the time to just walk away. Once the temperature drops below 100C (or 50C if you're paranoid) you can feel free to move things around.
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1 comment
Dec 5, 2005. 9:38 AMMr_Bill says:
Let the device cool slowly as stress can be built up if things cool quickly.

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