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Step 18Neaten up: Allow for alternate packages and options
We can drop some extra holes for mounting different packages. The transistors used in the published schematic that we entered apparently come in a sort of metal can package that has dropped in popularity. If we arrange for three in-line mounting holes, we can substitute a whole lot of different transistors whose package leads come that way (TO92 or TO220, to mention two popular modern packages.)
Use the info command to figure out the signal names, and then "via 'n$X'" on the command line to create the via, followed by a manual route to the via if needed. In this case, one of the vias placed collides with a signal trace hidden by the GND polygon, so we have to remove that trace with the "ripup" command (the polygon will still connect to the pad.)
While we're at it. I'll add some text to the silkscreen to show where the emitter lead of the transistors should go. Use the "text" icon button, and change the layer to tPlace.
Use the info command to figure out the signal names, and then "via 'n$X'" on the command line to create the via, followed by a manual route to the via if needed. In this case, one of the vias placed collides with a signal trace hidden by the GND polygon, so we have to remove that trace with the "ripup" command (the polygon will still connect to the pad.)
While we're at it. I'll add some text to the silkscreen to show where the emitter lead of the transistors should go. Use the "text" icon button, and change the layer to tPlace.
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Dec 22, 2006. 5:07 PMmctylr
says:
While you did rip-up the GND polygon around Q1 (2N3053), but I think you did not add an air-wire or signal route to the new via for the Base (B) pin of Q1. Or did I miss that step?
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