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I'm not sure I would agree with the last two comments. You can just about get away with it for SOIC-8 chips, if you have a VERY fine soldering tip and a steady hand, but when it comes down to SSOPs, where the inter-lead spacing is barely half a millimetre, I'd go for the solder paste solution every time!The only thing I would say is to be very careful with the hot air gun. It's easy to go WAY over the maximum temperature of the chip with those. I still prefer the oven approach. I modified a £17 toaster oven very easily and can now make perfect SMD boards virtually every time.
No John, I've read lots of 'ibles, but never created one yet!Maybe it's time....Phil
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