This is a short article about the technological process of diode. Hope you enjoy it.
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Step 1: Tip-out and Marking.
Step 2: Clean and Oxidize to Improve the Growth of SiO2.
Step 3: Add OAP and Well Stir the Glue.
Step 4: Perform Exposure Optical Carving, Developing and Post-baking.
Step 5: Hard Baking and Corrosion.
Step 6: Hard Baking and Injection.
Step 7: Stripping of Photoresist.
Step 8: Knot Push and Oxidize B to Form P + Isolation.
Step 9: Photoetching and Engraving Lead Holes.
Step 10: Clean. and Oxidize P- Before Injection.
Step 11: Inject P- to Increase the Voltage and Reduce Leakage Current.
Step 12: Implement the Bleaching of Acid to Remove the Oxide Layer of Lead Holes.
Step 13: Cleaning and Steaming Cr.
Step 14: Alloy to Form an Alloyed Potential Barrier.
Step 15: Striping Off Cr.
Step 16: Cleaning and Evaporating the Aluminum.
Step 17: Reversely Engraving the Aluminum.
Step 18: Back Thinning.
Step 19: Cleaning, Acid Bleaching and Back Metallization.
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